JPH0160773U - - Google Patents
Info
- Publication number
- JPH0160773U JPH0160773U JP15634687U JP15634687U JPH0160773U JP H0160773 U JPH0160773 U JP H0160773U JP 15634687 U JP15634687 U JP 15634687U JP 15634687 U JP15634687 U JP 15634687U JP H0160773 U JPH0160773 U JP H0160773U
- Authority
- JP
- Japan
- Prior art keywords
- solder paste
- paste board
- board
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000007598 dipping method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000007654 immersion Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15634687U JPH0160773U (en]) | 1987-10-13 | 1987-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15634687U JPH0160773U (en]) | 1987-10-13 | 1987-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160773U true JPH0160773U (en]) | 1989-04-18 |
Family
ID=31434806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15634687U Pending JPH0160773U (en]) | 1987-10-13 | 1987-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160773U (en]) |
-
1987
- 1987-10-13 JP JP15634687U patent/JPH0160773U/ja active Pending